METHOD FOR FORMING FLATTENED FILM, CERAMIC SUBSTRATE, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a flattened film of uniform thickness on a ceramic substrate with recesses on its surface so as to hard to cause cracking of the film and be capable of sufficiently flattening the recesses. SOLUTION: This method comprises the following steps: step 1 wherein a 1st flattening solution is applied on a ceramic substrate so as to fill recesses on the substrate therewith and to form a 1st flattened film, step 2 wherein the 1st flattened film is removed by a portion corresponding to a specified film thickness while leaving the film in the recesses, and step 3 wherein a 2nd flattening solution is applied on the 1st flattened film to form a 2nd flattened film.