发明名称 METHOD OF MAKING ELECTRODE
摘要 PROBLEM TO BE SOLVED: To provide a method of making a conductive material onto the surface of electronic parts, simple in the process, at a low cost with a simple process without causing no deterioration in the performance of the electronic parts. SOLUTION: This method of depositing an electrode on the surface of electronic parts using a ceramic material has a process step in which electronic parts are dipped into a solution using a cationic or anionic surfactant to control the polarity of the surface charge, a process step in which the electronic parts are brought into contact with a conductive solution containing a conductive material having the polarity reverse to that of the above controlled surface charge to deposit the conductive material onto the surface of the electronic parts and a process step in which, with the conductive material deposited onto the surface of the electronic parts as a base metallic film, electroplating is applied to.
申请公布号 JP2001098397(A) 申请公布日期 2001.04.10
申请号 JP19990274829 申请日期 1999.09.28
申请人 MURATA MFG CO LTD 发明人 YOSHIDA IKUSHI;KUNISHI TATSUO
分类号 H01G4/12;C23C18/16;C25D5/34;C25D5/54;C25D7/00;C25D21/12;H01G4/252;H01G4/30;H05K1/03;H05K3/18;(IPC1-7):C25D5/34 主分类号 H01G4/12
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