发明名称 |
SOLDER AND METHOD FOR SURFACE TREATMENT FOR PRINTED WIRING BOARD USING THE SOLDER AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ON THE BOARD USING THE SOLDER |
摘要 |
PROBLEM TO BE SOLVED: To provide a solder than can inhibit copper corrosion cracks while keeping a characteristic of high wettability and methods for surface treatment for printed wiring boards using the solder and for mounting electronic components on the surface of printed wire board using the solder. SOLUTION: The solder contains 1.0-4.0 wt.% of Ag, 0.4-1.3 wt.% of Cu, 0.02-0.06 wt.% of Ni, and 0.02-0.06 wt.% of Fe. The remainder consist of Sn and inevitable impurities.
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申请公布号 |
JP2001096394(A) |
申请公布日期 |
2001.04.10 |
申请号 |
JP19990275797 |
申请日期 |
1999.09.29 |
申请人 |
NEC TOYAMA LTD;SORUDAA KOOTO KK |
发明人 |
ITO TOSHIHIDE;HARA SHIRO |
分类号 |
B23K35/26;C22C13/00;H05K3/24;H05K3/34;(IPC1-7):B23K35/26 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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