发明名称 TRANSPARENT CONDUCTIVE POLYMER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a transparent conductive polymer substrate which shows outstanding resistance to solvent and gas barrier properties, and also high continuity reliability when the transparent conductive layer of the substrate is connected to an outer circuit. SOLUTION: This transparent conductive polymer substrate comprises a cured resin layer (B) formed at least on one of a transparent polymer base material (P) and a transparent conductive layer (E) formed on the cured resin layer (B). In addition, the substrate is characterized in that the hardness of the transparent conductive layer is 15 or more and its rate of plastic deformation is 50% or less, when the described properties are measured using a microhardness tester.
申请公布号 JP2001096661(A) 申请公布日期 2001.04.10
申请号 JP19990275946 申请日期 1999.09.29
申请人 TEIJIN LTD 发明人 HANADA TORU;SHIRAISHI ISAO
分类号 B32B7/02;G02F1/1333;H01B5/14;(IPC1-7):B32B7/02;G02F1/133 主分类号 B32B7/02
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