发明名称 |
EMBOSSED TAPE MANUFACTURING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide an embossed tape manufacturing device which manufactures an embossed tape having narrow partitions between housing dents precisely and stably by employing a pitch transfer molding method using flat metallic molds. SOLUTION: For an embossed tape manufacturing device which is composed of each one pair of upper and lower heating plates and upper and lower molding metallic molds and holds a belt-like sheet at a distance of one pitch corresponding to the entire length of the molding metallic mold with the paired upper and lower heating plates and also forms housing dents with pressure applied by the molding metallic molds while the heated belt-like sheet is moved by pitch transfer, the heating plates and the molding metallic molds are combined diagonally so that both of the members can be easily brought close together without being in contact with each other.
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申请公布号 |
JP2001097311(A) |
申请公布日期 |
2001.04.10 |
申请号 |
JP19990276655 |
申请日期 |
1999.09.29 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
NISHIJIMA MAMORU;SAKURAI TAKAHIRO |
分类号 |
B65B15/04;B29C51/10;(IPC1-7):B65B15/04 |
主分类号 |
B65B15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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