WIRE BONDING APPARATUS

摘要

PURPOSE: A wire bonding apparatus is provided to prevent defects of a ball shape and wire bonding even if the wire bonding apparatus performs a wire bonding process at high speed, by forming a circular or semicircular end shape of a torch. CONSTITUTION: A capillary head(55) includes a capillary(52) having a penetration hole through which a conductive wire for bonding a semiconductor chip and a leadframe passes. A torch(56) has a curved shape and surrounds the wire to form a spherical ball at an end portion of the wire. A clamping unit(57) pressures the wire and eliminates the pressure applied to the wire. A transfer unit makes the capillary and the clamping unit operate between the semiconductor chip and the leadframe. A control unit controls the transfer unit and the clamping unit.