发明名称 PRINTED CIRCUIT BOARD(PCB) MODULE FOR SURFACE MOUNT DEVICE(SMD)
摘要 PURPOSE: A printed circuit board(PCB) module is provided to prevent the position of the module from distortion by unstable soldering and maximize the soldering effect by fixing the flexure of the solder cream formed on the PCB module to the solder cream of the main PCB. CONSTITUTION: Of a printed circuit board(PCB) module, a second solder cream(40) maximizing the soldering effect by combining with the first solder cream of a main PCB is printed on the main PCB where corresponding to the side(32) of a PCB module(30) for SMD. Here, the width of the second solder cream(40) is the same as the width of the side(32) of the PCB module(30). The length(L) is below two thirds of the length of the side(32) of the module(30). The depth is between 190-210 μm. If the second solder cream(40) is longer than the PCB module(30), solder can penetrate into the flexure of the side(32) of the PCB module(30), affecting the copper laminates.
申请公布号 KR20010029108(A) 申请公布日期 2001.04.06
申请号 KR19990041739 申请日期 1999.09.29
申请人 LG INNOTEC CO., LTD. 发明人 LIM, DAE HO
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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