| 摘要 |
PURPOSE: A micro passive device and a fabricating method thereof are to reduce parasitic capacitance, dielectric damage and conductive damage generated from a substrate, thereby increasing quality of a product. CONSTITUTION: A signal connecting portion(4) is formed on a substrate(1). a conductive line(3) is formed on the substrate in a desired height. A via portion(2) connects the signal-connecting portion with the conductive line. The conductive line is supported by the first post. The conductive line is formed into a spiral type or a solenoid type, and has a thin film layer formed of a conductive material and a protective layer having high conductivity. The thin film layer is formed of Ni, and the protective layer is formed of Au or Ag. The signal-connecting portion is supported by the second post, which is formed on the substrate in a desired thickness, to have a desired height on the substrate. The conductive line is apart from the substrate at a desired air gap to reduce an influence from the substrate.
|
