CHIP SCALE PACKAGE

摘要

PURPOSE: A chip scale package is provided to reduce a package in thickness, by connecting an electrode pad of a semiconductor chip with a junction lead of a printed circuit board whenever the semiconductor chip is mounted. CONSTITUTION: An electrode pad(12) formed in a semiconductor chip is mounted in a printed circuit board having a junction lead. A polyimide coating layer(15) in which a window part(16) is formed to expose the electrode pad, is formed in the semiconductor chip. The junction lead is inserted into the window part of the polyimide coating layer by conductive adhesive tape, so that the semiconductor chip is electrically connected to the printed circuit board.