| 摘要 |
PURPOSE: A method for correcting alignment is provided to precisely correct mis-alignment generated in a specific portion of a wafer, by dividing the wafer into a plurality of areas, and by applying separate alignment correcting values regarding the respective areas. CONSTITUTION: A wafer is divided into a plurality of areas. An additional alignment correcting value is used in the respective areas of the wafer, which is as follows. N correcting shots are designated in the respective areas of the wafer. Coordinate values of alignment marks are measured in the N correcting shots of the respective areas of the wafer. An alignment is performed by applying alignment correcting values calculated from the measured values to the respective areas of the wafer corresponding to the alignment correcting values.
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