| 摘要 |
PURPOSE: A novel polyimide precursor and a photosensitive resin composition using the same are provided, thereby the positive photosensitive polyimide precursor having the increased solubility to an alkali solution as well as organic solvents can be produced. CONSTITUTION: The polyimide precursor represented by the formula (1) contains 0.1 to 100 mol% of siloxane containing diamine, represented by the formula (2), in which X is aromatic or aliphatic group having at least 4 bound waters and 4 to 24 carbon numbers; R is selected from the group consisting of hydrogen, saturated aliphatic group containing ethyl, methyl, n-propyl and isopropyl, and unsaturated aliphatic group containing aryl, 2-hydroxyethylmethacrylate, and 2-hydroxyethylacrylate; Y is aromatic group having 4 to 36 carbon numbers; z is an integer of above 10; A is the same or different, C4 to C24 aliphatic group containing methyl, ethyl, propyl, butyl, isopropyl, isobutyl methoxy, ethoxy, protoxy, and butoxy, C4 to C24 aromatic group containing phenyl and phenoxy, or halogen containing chloride, bromide, fluoride, and iodide; n is an integer of 1 to 4; B is the same or different, C1 to C6 aliphatic group containing methyl, ethyl, propyl, butyl, isopropyl, isobutyl, and vinyl, or C4 to C24 containing phenyl.
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