| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device for reducing packaging volume and weight and for performing lamination arrangement with a semiconductor chip size, and the semiconductor device. SOLUTION: A first process for forming a pattern on a semiconductor chip, a second process for forming a hole on the semiconductor chip, a third process for providing a screening part on the inner wall surface of the hole, a fourth process for polishing a surface at the tip side of the hole in the semiconductor chip for setting the hole to a through-hole, and a fifth process for forming a conductive part on the inner wall surface of the through-hole are at least provided. |
