| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, which can be tested for confirming the function of each semiconductor chip element and for confirming only the connecting state of a first semiconductor chip and a second semiconductor chip etc., even after the first semiconductor chip and the second semiconductor chip are jointed. SOLUTION: In each bump BM of a master chip 1, an extending part 14 drawn out from the bump BM to the outside of a junction region 12 is formed long integrally with the bump. That is, the bump BM of the master chip 1 is formed long in a state bridging the boundary part of the junction region 12. Thereby, after the master chip 1 and a subordinate chip 2 are jointed, the operation confirmation of only the master chip 1 or the subordinate chip 2 and the connection confirmation of the master chip 1 and the subordinate chip 2 are enabled, by pressing test probes P against the parts of the extending part 14 which is drawn out to the outside of the junction region 12. |
