发明名称 APPARATUS AND METHOD FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To keep the throughput of substrates from lowering due to the process time variation of a previous process, in a substrate treating apparatus for treating substrates received every fixed cycle time. SOLUTION: This substrate treating apparatus holds and transfers a plurality of substrate en bloc along a path from a receiving section to a first treatment zone, a second treatment zone and an ejection section, and when the treating apparatus needs to transfer the substrates very fixed cycle time T1, the substrate transfer start is delayed for a prescribed waiting time T2 from time 0, at which the first substrate is received. Thus, if the receiving time of the substrate is delayed by a timeΔT due to the operation variation in the preceding step, the substrate can be transferred as scheduled. As the result, it is possible to avoid failure in receiving the substrates and to lower the throughput.
申请公布号 JP2001093955(A) 申请公布日期 2001.04.06
申请号 JP19990271019 申请日期 1999.09.24
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 NISHIOKA KENTARO
分类号 H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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