发明名称 SURFACE TREATING APPARATUS USING PLASMA
摘要 PURPOSE: A surface treating apparatus using plasma is provided to uniformly treating surface of a metal material by installing an anode electrode between the metal material and a heating material so that plasma is formed surrounding the metal material, and easily perform a high temperature process of around 900 deg.C by easily increasing the metal material to a high temperature. CONSTITUTION: The surface treating apparatus using plasma is characterized in that electric field is formed between the metal material (1) and the anode electrode (150) by installing one or more anode electrodes (150) between the metal material (1) and the heating material (120) in an apparatus for treating surface of the metal material by the processes of heating to an arbitrary reaction temperature through a heating material (120) by infusing a process gas into the chamber (110) in the state that a metal material (1) is installed in a chamber (110), and forming plasma surrounding the metal material by impressing an arbitrary pulse type negative voltage to the metal material (1).
申请公布号 KR20010028483(A) 申请公布日期 2001.04.06
申请号 KR19990040751 申请日期 1999.09.21
申请人 INSTITUTE FOR ADVANCED ENGINEERING 发明人 BAEK, JONG MUN;CHO, YEONG RAE
分类号 C23C16/00;(IPC1-7):C23C16/00 主分类号 C23C16/00
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