发明名称 RAMBUS MEMORY MODULE AND SOCKET COUPLED WITH THE SAME
摘要 PURPOSE: A RAMBUS memory module and a socket coupled with the RAMBUS memory module are provided to improve the efficiency of a system by preventing the lowering of the signal preservation and the signal transferring characteristics generated by the RAMBUS memory module. CONSTITUTION: A FPCB section(10) is formed of layers in which signal lines are formed and layers to which the ground voltage and the power source voltage is applied. The FPCB section(10) can be deformed. The first multi-layer PCB(20) comprises one end portion of the FPCB section(10) in the interior thereof. The second multi-layer PCB(30) comprises the other end of the FPCB section(10) in the interior thereof. The first devices are disposed on both surfaces of the first multi-layer PCB(20) along the signal lines. The second devices are disposed on both surfaces of the second multi-layer PCB(30) along the signal lines. A plurality of signal inputting connector taps(60a) transfers the signals from a system board to one end of the FPCB section(10). A plurality of signal outputting connector taps(70a) transfers the signal outputted from the other end of the FPCB section(10) to a socket.
申请公布号 KR20010025800(A) 申请公布日期 2001.04.06
申请号 KR19990036831 申请日期 1999.09.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, SANG WON
分类号 H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/00
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