| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit forming method by which excellent workability and excellent uniformity of a metal film can be obtained. SOLUTION: A photosensitive resin composition layer is formed on a board and exposed and developed to form a resist pattern and, after metal powder is sprayed upon the recessed parts of the resist pattern by high pressure gas to form a metal film, the cured resist layer is removed to form a circuit. Or, a photosensitive resin composition layer is formed on a board and exposed and developed to form a resist pattern and, after metal powder is sprayed upon the recessed parts of the resist pattern by high pressure gas to form a metal film, the cured resist layer is removed, the part from which the resist layer is removed is etched and then the metal film is removed to form a circuit. Or, a photosensitive resin composition layer is formed on a board and exposed and developed to form a resist pattern and, after metal plating is applied to the recessed parts of the resist pattern and metal powder is sprayed upon the recessed parts of the resist pattern by high pressure gas to form a metal film, the cured resist layer is removed, the part from which the resist layer is removed is etched and then the metal film is removed to form a circuit.
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