| 摘要 |
IC chip insulation, by depositing low viscosity insulating material (207) on its active face surface portion between its connection bumps, is new. Independent claims are also included for the following: (i) a method of insulating several IC chips by fixing the back face of a multi-chip silicon wafer on a work support, cutting the wafer to form individual chips and then carrying out the above process; (ii) an IC chip having an insulating material layer covering its entire active face surface, except for its bumps, and its side faces; (iii) a silicon wafer comprising several individual chips as described above; and (iv) an IC chip support device comprising the above chip. |
