| 摘要 |
PURPOSE: An apparatus for settling a wafer of a copper electroplating equipment is provided to form a copper plating layer of a uniform thickness, by installing a contact terminal of a coil spring shape in a settling part where the wafer is settled, and by installing a pressure unit for better contact, in the settling part. CONSTITUTION: An apparatus(10) for settling a wafer is installed in a settling part(4) electrically contacting a terminal contact part formed in a lower portion of a wafer to form a copper plating layer in a side of the wafer. A step portion is so formed that the wafer is inserted to the inside of the settling part. A plurality of the apparatuses for settling the wafer are symmetrically installed in a circumference of the step portion, having a coil spring shape and including a contact terminal(11) connected to a cathode.
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