| 摘要 |
PURPOSE: A method for manufacturing a chip scale type semiconductor package using a flip chip bonding is provided to prevent damage of solder bumps and a semiconductor chip. CONSTITUTION: In the method, a plurality of chip pads(2) are formed on the semiconductor chip(1), and a chip passivation layer(3) is formed on the chip(1) except the chip pads(2). Thereafter, under barrier metal patterns(4) are formed on the respective chip pads(2), and dummy metal patterns(5) are then formed thereon. Next, solder bumps(6) are formed on the respective dummy metal patterns(5). On the other hand, a plurality of substrate pads(12) are formed on a printed circuit substrate(11), and a substrate passivation layer(13) is formed on the circuit substrate(11) except the substrate pads(12). Then, a lower and an upper plating pattern(14,15) are sequentially formed on the respective substrate pads(12), and dummy solder bumps(16) are formed on the respective upper plating patterns(15). After that, while the chip(1) faces the substrate(11), the solder bumps(6) and the dummy solder bumps(16) are joined together.
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