| 摘要 |
PURPOSE: A substrate for manufacture of a semiconductor package is provided to prevent an overflow of an encapsulant and thereby to prevent related defects. CONSTITUTION: The substrate includes a polyimide tape(13) having a copper pattern(14) formed thereunder to receive a solder ball, and an elastomer(12) interposed between the polyimide tape(13) and a chip(11). In addition, the polyimide tape(13) has a window formed therein for a lead bonding process and an encapsulation process. In particular, the substrate further includes an additional copper pattern formed at an outer periphery of the window. The additional copper pattern can prevent the encapsulant(15) supplied through the window from overflowing, thus acting as a dam. Accordingly, the encapsulant(15) is confined within a cutting line during a subsequent cutting process for the singulation of the package.
|
