发明名称 CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electronic device which can prevent incomplete sealing for electronic parts and incorrect marking for resin covered material. SOLUTION: A ceramic circuit board 10 is provided with circuit board regions 11 having metallized circuit conductors 3 with which a mounting part 1a for electronic parts 2 and each electrode are connected at the center, by putting a separating line 12 inbetween and by vertically and horizontally arranging in a unit and with a marginal region 13 having a frame shape with which a metallized metallic layer 14 having a frame shape is so applied on the major surface of the mounting part 12 as to enclose the circuit board regions 11 at the periphery. After the electronic parts 2 are mounted on each mounting part 1 and each electrode is connected with the circuit conductor 3, a mold 30 is made to firmly contact the metallic layer 14 and the inside of a space S in the circuit board 10 is filled with the liquid resin covering material 15 to harden. The circuit board 10 and the hardened resin covering material 15 are separated along the separating line 12. An electric device of which surface is covered with the resin covering material can be obtained.
申请公布号 JP2001093924(A) 申请公布日期 2001.04.06
申请号 JP19990270413 申请日期 1999.09.24
申请人 KYOCERA CORP 发明人 FURUMOTO YUICHI
分类号 H05K1/02;H01L21/56;H01L23/28;H05K3/00 主分类号 H05K1/02
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