发明名称 LEAD FRAME AND LEAD FRAME MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a lead frame, in which fixing to a package is completed quickly and the troubles of incorrect bending of a lead are scarcely generated, and a manufacturing method of the lead frame. SOLUTION: This lead frame is provided with a plurality of arranged leads 2 and one or a plurality of sticking layers 3 for fixing the arrangement. This manufacturing method is provided with a process for spreading adhesive agent on the plurality of arranged leads 2, and a process for forming the sticking layers 3 between the plurality of leads 2 by causing the adhesive agent to harder.
申请公布号 JP2001094029(A) 申请公布日期 2001.04.06
申请号 JP19990266140 申请日期 1999.09.20
申请人 NEC CORP 发明人 SHIRAKAWA YASUTSUGU
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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