| 摘要 |
PURPOSE: A method for manufacturing a micro switch is provided to reduce time taken to manufacture the switch device, by eliminating a sacrificial layer within a short period of time by using a wet-etching method. CONSTITUTION: The first metal is formed and patterned on a substrate(1) to form a plurality of molds, and the second metal is deposited in the plurality of molds. The first metal is formed on the entire surface, and is selectively patterned to expose the second metal formed on both side molds to form a plurality of via molds. The third metal is deposited in the plurality of via molds. After a seed metal layer(12) and a sacrificial layer are sequentially formed on the entire surface, the sacrificial layer is patterned to form a mold across the third metal, and the fourth metal is deposited in the mold. After the sacrificial layer is removed, the first metal is eliminated by a wet-etch process.
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