GROUND STRUCTURE OF APPARATUS FOR MANUFACTURING SEMICONDUCTOR

摘要

PURPOSE: A ground structure of an apparatus for manufacturing a semiconductor is provided to stabilize a process and maintain uniformity of a layer by preventing a flickering phenomenon of plasma. CONSTITUTION: A settling unit on which a wafer is placed is located inside a chamber wall, constituting a cathode. A lead constitutes an anode, coupled to an upper portion of the chamber wall. A metal band(14) is adhered to the upper portion of the chamber wall and a lower surface of the lead to constitute a ground.