| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for die bonding pressure sensor chip by which adherence between a pressure sensor chip and a body block can be improved, by easily uniformly applying an adhesive and performance deterioration or variation of a pressure sensor caused by the adhered state between the chip and block can be prevented. SOLUTION: In a method for die bonding pressure sensor chip in which a pressure sensor chip 1 is adhered to a body block 2 with an adhesive 3, the adhesive 3 is transferred to the adhesive surface 2b of the body block 2 by using an adhesive transfer pin 8 having a flat sharp end and, after the adhesive 3 closing the pressure introducing hole 2a of the adhesive surface 2b is removed by blowing air into the hole 2a, the pressure sensor chip 1 is mounted on and adhered to the adhesive surface 2b. |
