HEAT PLATE HAVING GROOVE

摘要

PURPOSE: A heat plate having a groove is provided to prevent an ashing rate from being lowered when loading a wafer using a support pin in a reaction chamber and to load the wafer by a loading arm without the support pin. CONSTITUTION: A heat plate(150) consists of a body(110) having a top surface(112) having a predeterminded thickness on which a wafer is laid and a number of guide pins(114) projected along border of an area on which the wafer is laid. A groove(130) having a width and a depth is formed from a side of the body(110) to the center of the body(110). The width of the groove(130) is larger than a width of a loading arm and the depth of the groove(130) is deeper than a thickness of the loading arm. The groove(130) is formed in direction that the loading arm is slided. A vacuum device is equipped with the loading arm to absorb and transfer the wafer.