| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an interconnection board whose wiring conductor layers and via conductors made of metal powder and thermosetting resin are free from significant increases of resistance values which are caused by a pressure cooker test by a method wherein radical polymerization type thermosetting resin is used as the thermosetting resin in place of conventional epoxy system resin containing hydroxide radicals which cause oxidation of metal powder. SOLUTION: An interconnection board comprises an insulating substrate made of inorganic insulating powder bonded with thermosetting resin, wiring conductor layers which are formed on the surface and/or inside of the insulating substrate and made of metal powder bonded with thermosetting resin and via conductors which are formed in the insulating substrate and made of metal powder bonded with thermosetting resin and with which the wiring conductor layers are electrically connected to each other. Radical polymerization type thermosetting resin which does not contain hydroxide radicals is employed as the thermosetting resin contained in the insulating substrate, the wiring conductor layers and the via conductors. With this constitution, the metal powder contained in the wiring conductor layers and the via conductors is hardly oxidized, so that the significant increases of their resistance values can be avoided.</p> |
