METHOD FOR MOUNTING SEMICONDUCTOR ELEMENT AND MOUNTED STRUCTURE BODY

摘要

PROBLEM TO BE SOLVED: To provide a mounting method excellent in workability and reliability and a mounted structure body. SOLUTION: A sealing film 7b is adhered to the outside of an area on a circuit board 4 where a semiconductor element 1 is mounted, and a sealing paste 7a is applied to the inside thereof. When the semiconductor element 1 is mounted on the circuit board 4 while pressuring and heating the rear surface thereof, the sealing film 7b can block the flowing of the sealing paste 7a to the outside of the semiconductor element mounting area, thereby preventing a decrease in workability due to adhesion of the flowed-out sealing paste 7a and a semiconductor transfer tool.