摘要 |
PROBLEM TO BE SOLVED: To provide a spool case for a semiconductor bonding wire in which at least either a container or a lid of a spool case for housing a spool wound with a bonding wire is provided with a holding part for holding the spool, the spool can be held securely by the holding part, and the spool can be released easily when the holding is released. SOLUTION: This spool case for holding a spool 1 wound with a bonding wire, is composed of a container 2 and a lid 3 which are engaged with each other. At least either thereof is provided with an inside holding part 6 for holding the inner side of the cylinder 4 of the spool 1 and an outside holding part 6 for holding the outer periphery of the flange 5 of the spool 1 in the direction 1 of the circumference of the spool 1, and the spool 1 is held by both holding parts.
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