发明名称 SPOOL CASE FOR SEMICONDUCTOR BONDING WIRE
摘要 PROBLEM TO BE SOLVED: To provide a spool case for a semiconductor bonding wire in which at least either a container or a lid of a spool case for housing a spool wound with a bonding wire is provided with a holding part for holding the spool, the spool can be held securely by the holding part, and the spool can be released easily when the holding is released. SOLUTION: This spool case for holding a spool 1 wound with a bonding wire, is composed of a container 2 and a lid 3 which are engaged with each other. At least either thereof is provided with an inside holding part 6 for holding the inner side of the cylinder 4 of the spool 1 and an outside holding part 6 for holding the outer periphery of the flange 5 of the spool 1 in the direction 1 of the circumference of the spool 1, and the spool 1 is held by both holding parts.
申请公布号 JP2001093930(A) 申请公布日期 2001.04.06
申请号 JP19990266059 申请日期 1999.09.20
申请人 NITTETSU MICRO METAL:KK 发明人 KOMORI KIYOTSUGU
分类号 B65D85/00;B65H75/00;H01L21/60;(IPC1-7):H01L21/60 主分类号 B65D85/00
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