发明名称 METHOD FOR BURYING GAP BY OXIDE LAYER
摘要 PURPOSE: A method for burying a gap by an oxide layer is to provide a good gap filling of an oxide layer while controlling generation of a void, by making the oxide layer deposited on a bottom of the gap but not deposited on a side of the gap. CONSTITUTION: Direct current(DC) power is applied to a sputtering target made of a silicon material. Radio frequency(RF) power only or RF power and DC power together is applied to a heater block on which a substrate(100) is mounted and to a coil of a silicon material between the targets. Alternate current(AC) power is applied to the heater block.
申请公布号 KR20010025924(A) 申请公布日期 2001.04.06
申请号 KR19990036989 申请日期 1999.09.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, MIN
分类号 H01L21/316;(IPC1-7):H01L21/316 主分类号 H01L21/316
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