发明名称 |
METHOD FOR BURYING GAP BY OXIDE LAYER |
摘要 |
PURPOSE: A method for burying a gap by an oxide layer is to provide a good gap filling of an oxide layer while controlling generation of a void, by making the oxide layer deposited on a bottom of the gap but not deposited on a side of the gap. CONSTITUTION: Direct current(DC) power is applied to a sputtering target made of a silicon material. Radio frequency(RF) power only or RF power and DC power together is applied to a heater block on which a substrate(100) is mounted and to a coil of a silicon material between the targets. Alternate current(AC) power is applied to the heater block.
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申请公布号 |
KR20010025924(A) |
申请公布日期 |
2001.04.06 |
申请号 |
KR19990036989 |
申请日期 |
1999.09.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, MIN |
分类号 |
H01L21/316;(IPC1-7):H01L21/316 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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