| 摘要 |
PURPOSE: A singulation apparatus for a semiconductor package is provided to improve productivity by not only separating the package from a lead frame but also loading the package into a tray. CONSTITUTION: The singulation apparatus includes the tray(30) disposed under the lead frame(L) to carry the individual package(P) separated from the lead frame(L). The apparatus further includes a punch holder(20) having plural slide holes(22) divided by a punch guide(21). The punch guide(21) has a concave part thickness of which corresponds to a distance(d1) between the adjacent packages(P), and a convex part thickness of which corresponds to a distance(d2) between adjacent package-receiving grooves(31) of the tray(30). In addition, the apparatus includes punches(10), each of which is slidably inserted in the slide hole(22) and has a vacuum hole. Each punch(10) goes down along the slide hole(22) and then separates the package(P) from the lead frame(L) at a position of the concave part. After that, the punch(10) goes further down and then loads the separated package(P) into the tray(30) at a position of the convex part.
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