发明名称 |
SYSTEM FOR DEPOSITING THIN FILM |
摘要 |
PURPOSE: A system for depositing a thin film is provided to improve work efficiency, by downloading a process condition of equipment so that a belt speed of the process equipment as a factor for determining a thickness of a layer is automatically controlled. CONSTITUTION: A process equipment(16) evaporates a thin film while transferring a wafer to a transfer unit inside. A measurement system(20) samples the wafer having the thin film by a predetermined lot unit. A boron phosphorous silicate glass(BPSG) server(12) collects data necessary for a thin film evaporation process, and controls the thickness of the thin film by controlling a speed of a transfer unit for transferring the wafer in the process equipment by a wafer transfer speed, a thickness of the thin film measured in the measurement system and a previously-established reference thickness. The BPSG server establishes a process condition including a speed of a belt to control for adjusting the thickness of the thin film. An equipment interface system(18) downloads the process condition established in the BPSG server to the process equipment.
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申请公布号 |
KR20010025871(A) |
申请公布日期 |
2001.04.06 |
申请号 |
KR19990036921 |
申请日期 |
1999.09.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG, SEONG JUN;JUN, TAE HA |
分类号 |
H01L21/20;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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