发明名称 SYSTEM FOR DEPOSITING THIN FILM
摘要 PURPOSE: A system for depositing a thin film is provided to improve work efficiency, by downloading a process condition of equipment so that a belt speed of the process equipment as a factor for determining a thickness of a layer is automatically controlled. CONSTITUTION: A process equipment(16) evaporates a thin film while transferring a wafer to a transfer unit inside. A measurement system(20) samples the wafer having the thin film by a predetermined lot unit. A boron phosphorous silicate glass(BPSG) server(12) collects data necessary for a thin film evaporation process, and controls the thickness of the thin film by controlling a speed of a transfer unit for transferring the wafer in the process equipment by a wafer transfer speed, a thickness of the thin film measured in the measurement system and a previously-established reference thickness. The BPSG server establishes a process condition including a speed of a belt to control for adjusting the thickness of the thin film. An equipment interface system(18) downloads the process condition established in the BPSG server to the process equipment.
申请公布号 KR20010025871(A) 申请公布日期 2001.04.06
申请号 KR19990036921 申请日期 1999.09.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HWANG, SEONG JUN;JUN, TAE HA
分类号 H01L21/20;(IPC1-7):H01L21/20 主分类号 H01L21/20
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