METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To remove a photoresist film without damaging an insulating film containing organic components. SOLUTION: A photoresist film 14b is formed on an insulating film 13 containing organic components as a mask for etching the unwanted potions of the insulating film 13. In order to remove the photoresist film 14b after the unwanted portions of the insulating film 13 are etched by using the photoresist film 14b as the mask, the photoresist film 14b is removed by using an adhesive sheet 16 so as not to give damages to the insulating film 13.