METHOD FOR DIE BONDING PRESSURE SENSOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a method for die bonding pressure sensor chip by which adherence between a pressure sensor chip and a body block can be improved by uniformly applying an adhesive, and the performance deterioration or variation of a pressure sensor caused by the adhering state between the chip and block can be prevented. SOLUTION: In a method for die bonding pressure sensor chip in which a pressure sensor chip 1 is adhered to a block block 2 with an adhesive 3, transfer amount control members (9, 10) are provided to either a collet 7 holding the pressure sensor chip 1 or a paste tank 8 holding the adhesive 3 and the chip 1 is mounted on and adhered to the body block 2 after the adhesive 3 is transferred to the chip 1 by vertically lowering the collet 7 into the paste tank 8.