发明名称 LIQUID APPLIED TO FORM CONDUCTIVE FILM AND USAGE OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide coating liquid that shows excellent in dispersion stability in a state of liquid and can form a conductive film that is excellent in conductivity and weatherability by a low-temperature heat treatment. SOLUTION: In liquid according to the invention, metallic film particles are dispersed by reducing and precipitating the same by adding a reducing agent to such liquid that contains water soluble resin formed of metallicious and cellulose derivative (for example, hydroxyl propyl cellulose) and by making the water soluble resin gelled through a heat treatment.
申请公布号 JP2001093414(A) 申请公布日期 2001.04.06
申请号 JP19990266068 申请日期 1999.09.20
申请人 ASAHI GLASS CO LTD 发明人 ABE KEISUKE;SANADA YASUHIRO;TAKEMIYA SATOSHI;IGUMA HISAO
分类号 H01J9/20;B05D7/24;B22F9/24;H01J29/88;H05K9/00;(IPC1-7):H01J9/20 主分类号 H01J9/20
代理机构 代理人
主权项
地址