发明名称 |
LIQUID APPLIED TO FORM CONDUCTIVE FILM AND USAGE OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide coating liquid that shows excellent in dispersion stability in a state of liquid and can form a conductive film that is excellent in conductivity and weatherability by a low-temperature heat treatment. SOLUTION: In liquid according to the invention, metallic film particles are dispersed by reducing and precipitating the same by adding a reducing agent to such liquid that contains water soluble resin formed of metallicious and cellulose derivative (for example, hydroxyl propyl cellulose) and by making the water soluble resin gelled through a heat treatment.
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申请公布号 |
JP2001093414(A) |
申请公布日期 |
2001.04.06 |
申请号 |
JP19990266068 |
申请日期 |
1999.09.20 |
申请人 |
ASAHI GLASS CO LTD |
发明人 |
ABE KEISUKE;SANADA YASUHIRO;TAKEMIYA SATOSHI;IGUMA HISAO |
分类号 |
H01J9/20;B05D7/24;B22F9/24;H01J29/88;H05K9/00;(IPC1-7):H01J9/20 |
主分类号 |
H01J9/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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