METHOD FOR COOLING STAGE OF EQUIPMENT FOR TESTING WAFER

摘要

PURPOSE: A method for cooling a stage of an equipment for testing a wafer is provided to prevent a decrease of equipment efficiency, in which the decrease is caused because the temperature of the stage is not easily changed from a high temperature to a room temperature when the wafer is tested at the high temperature and the room temperature in the equipment. CONSTITUTION: An air spraying apparatus is installed in an equipment for testing a wafer, in which the air spraying apparatus forcibly and uniformly supplies coolant air to the entire surface of a stage on which the wafer is placed.