APPARATUS FOR SUPPLYING SLURRY

摘要

PURPOSE: An apparatus for supplying slurry is provided to reduce an area occupied by the apparatus for supplying slurry, by manufacturing the slurry while supplying the slurry without a separate apparatus for mixing the slurry and deionized water. CONSTITUTION: A circulating pipe(30) is connected to a chemical mechanical polishing(CMP) apparatus. A slurry supply unit supplies a precise quantity of slurry by a slurry supply pipe. A deionized(DI) wafer supply unit(17) supplies a precise quantity of DI wafer by a DI supply pipe. One end of a mixing pipe(19) is connected to the slurry supply pipe and the DI water supply pipe wherein the slurry and the DI water are supplied and mixed. The other end of the mixing pipe is connected to the circulating pipe.