| 摘要 |
PURPOSE: A chemical mechanical polishing(CMP) apparatus is provided to greatly reduce the entire area of the CMP apparatus by not using an apparatus for turning over a wafer, and to decrease the time taken for the wafer to be transferred by a robot by simplifying a structure of the robot. CONSTITUTION: A wafer cassette in which wafers are loaded is received in a cassette loader(120,130). A polisher(220,230) receives the wafer from the wafer cassette and polishes the wafer with slurry. A unit(140,150) for eliminating the slurry firstly removes the slurry on the wafer, installed near the polisher. A cleaning unit(160,170) cleans and dries the wafer without the slurry, installed near the unit for eliminating the slurry. A transfer unit(200,210) transfers the wafer from the unit for eliminating the slurry to the cleaning unit. A wafer transfer robot takes out the wafer from the wafer cassette and settles the wafer in the polisher. The wafer transfer robot has the first and second robots. The first robot(180) unloads the wafer from the cleaning unit to the cassette loader. The second robot(190) transfers the wafer from the polisher to the unit for eliminating the slurry.
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