发明名称 TEMPERATURE SENSOR FIXING METHOD ON ELECTRONIC EQUIPMENT
摘要 PURPOSE: A temperature sensor fixing method on the electronic equipments is provided to increase the productivity and to decrease the inferior goods by injection molding method. CONSTITUTION: The temperature sensor fixing method includes steps of attaching the spring holder(28) to the holder(22), arranging the temperature sensors(21) in series over the spring holder, packing the arranged temperature sensors by a functional resin(23) through the catapult, enhancing the functional resin characteristic by coating with function enriched material(24), verifying inferiority by measuring the resistance of the temperature, fixing the lead line(25) of the temperature sensor to the plate holder by spot welding, covering the insulating tube(27) over the welding area, inspecting inferiority by an electrical connection test at the ends of wire harness(26), and verifying the temperature sensor position and the external appearance. The lubricative function enriched material enhances the anti-abrasion by increasing the coefficient of surface friction.
申请公布号 KR20010028140(A) 申请公布日期 2001.04.06
申请号 KR19990040217 申请日期 1999.09.17
申请人 CHA, GU IK;LEE, MAN WOO 发明人 CHA, GU IK;JUNG, HAE GWAN;LEE, MAN WOO
分类号 H05K13/00;(IPC1-7):H05K13/00 主分类号 H05K13/00
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