MULTIFUNCTION LEAD FRAME AND INTEGRATED CIRCUIT PACKAGE INCORPORATING THE SAME

摘要

The present invention provides a lead frame for use in packaging a circu it having a discrete component, and a method of manufacture thereof. In one embodiment, the lead frame includes a lead support structure and a plurality of severable leads that are coupled to the lead support structure. The pluralit y of severable leads extend inward from the lead support structure to predetermined locatio ns corresponding to terminals of the discrete component.