TEST HEAD OF APPARATUS FOR TESTING SEMICONDUCTOR ELECTRICAL DIE SORTING

摘要

PURPOSE: A test head of an apparatus for testing a semiconductor electrical die sorting(EDS) is provided to prevent electrical leak by preventing a pin from being gotten out of a slot of a mother board because of an impact applied to the mother board of a test head when the test head turns on/off. CONSTITUTION: An electrical signal for performing an electrical die sorting(EDS) process is generated from a source for generating the electrical signal. The electrical signal is applied to the exterior through respective pins(34) inserted into a plurality of slots(32) of a mother board(30). A buffer unit for buffering an impact applied to the mother board is embodied in the mother board.