| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip in which a pad for external connection is hardly corroded regardless of the connection condition of a wire. SOLUTION: An opening 17B is made in a surface protection film 16 around the periphery of a master chip 1 so that an inner wiring 15 is partly exposed over the surface protection film 16, and an outer connection pad 15B is formed thereby. A wire connection part 12 using the same oxidation resistant metallic material as a bump BM is formed projecting over the external connection pad 15B so as to connect a bonding wire. |
