METHOD OF FABRICATING FLEXIBLE CIRCUIT STRUCTURE AND MATERIAL FOR IT

摘要

PROBLEM TO BE SOLVED: To provide a method of fabricating a flexible circuit structure which is efficient and has excellent cost-performance and materials for the method. SOLUTION: A separation layer 11 is deposited on a substrate 10 and a conductive laminated layer 20 is formed on the dissociation layer 11. As the dissociation layer 11 is formed, a conductive laminated layer part 30 can be dissociated easily from the substrate 10 to form a flexible circuit structure 40.