| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a ceramic electronic component having few short troubles. SOLUTION: This manufacturing method includes a first process of pressing a ceramic sheet 10a, containing ceramic powder and an organic matter to reduce the percentage of voids, a second process of forming a conductor layer 2, using a metallic past on this ceramic sheet 10b next, the third process of getting a stack by stacking a plurality of ceramic sheets 10b where these conductor layers 2 are made such that the conductor layers 2 face each other, with the ceramic sheet 10b between each, and the fourth process of baking this stack, and since the conductor layer 2 is made on the ceramic sheets 10b after reducing the percentage of voids, the penetration of metallic components into the ceramic sheet 10b can be suppressed.</p> |
