METHOD OF FABRICATING PRINTED WIRING BOARD AND PRINTED WIRING BOARD FABRICATED BY THE METHOD

摘要

PROBLEM TO BE SOLVED: To provide the method of fabricating a printed wiring board by which printed wiring boards with high density wiring conductors having cross-sections approximately rectangular can be fabricated with a high yield and provide a printed wiring board which is fabricated by the method and has high density wiring conductors having cross-sections approximately rectangular. SOLUTION: The method of fabricating a printed wiring board includes a resist pattern forming process in which a resin resist pattern 14 film is formed on a metal foil 12 on the surface of an insulating board 10 with a metal foil, a half-etching process in which the part of the metal foil in a thickness direction is removed by etching by using the resin resist pattern film as an etching resist film, a heating process in which the resin resist pattern film 18 is heated at a temperature higher than the softening temperature of the resin resist pattern film and an etching process in which the remaining part of the metal foil in the thickness direction is removed by etching.