发明名称 LAMINATED CHIP COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a laminated chip component, which can prevent defects in connection and disconnection between a terminal electrode and a lead-out electrode by suppressing degeneration due to vaporization and diffusion at baking of the electrode material of the lead-out electrode of a coil-forming conductor. SOLUTION: Magnetic body layers 1a to 1g and coil-forming conductors 2a to 2f are laminated and sintered, to constitute an inductor or a laminated chip component which includes an inductor. Terminal electrodes 6a and 6b, provided on the external surface of the laminated chip component, are connected to lead-out electrode parts 3a and 3b of the coil-forming conductors. Dummy electrodes 5a to 5b are formed in the laminated sinter, so that they are partially exposed in the exposed surfaces of the lead-out electrode parts 3a and 3b.
申请公布号 JP2001093745(A) 申请公布日期 2001.04.06
申请号 JP19990271999 申请日期 1999.09.27
申请人 TDK CORP 发明人 IKEDA YOJI;ABE YUTAKA
分类号 H01F27/28;H01F17/00;H01F27/00;H01F27/29;(IPC1-7):H01F27/28 主分类号 H01F27/28
代理机构 代理人
主权项
地址