| 摘要 |
PURPOSE: A method of matching an exposing apparatus is to facilely and exactly match the exposing apparatuses, thereby increasing productivity of a semiconductor device. CONSTITUTION: A first exposing process is performed on a reference wafer(10) using a reference reticle having the first and second patterns which are apart from each other. A developing and etching process is performed to form the first and second protrusion(13,15), corresponding to the first and second patterns, and an etching groove(11) enclosing the protrusions on the wafer. The second exposing process is performed on the wafer using the reference reticle to form an overlapping pattern, which is overlapped with the first protrusion and correspondent to the second pattern. Then, data related to a matching process of an exposing apparatus is measured. The overlapping pattern is formed of a photoresist pattern(33,35). After measuring the data, the photoresist patterns are removed.
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