SEMICONDUCTOR MANUFACTURING APPARATUS FOR PERFORMING CHEMICAL MECHANICAL POLISHING PROCESS

摘要

PURPOSE: A semiconductor manufacturing apparatus for performing a chemical mechanical polishing(CMP) process is provided to prevent a specific portion of a layer of a wafer from being over-polished or under-polished, and to form a uniform layer of the wafer by measuring the entire thickness of the layer of the wafer. CONSTITUTION: A polishing table(110) has a space part inside. A polishing pad(120) is settled on the polishing table. An end point detecting unit is supplied to the space part of the polishing table, irradiating beam to the entire lower surface of a wafer(200) supplied to an upper surface of the polishing pad and detecting the beam reflected from the lower surface of the wafer. A control unit(160) analyzes a light signal inputted from the end point detecting unit, and determines the thickness of a layer formed on the lower surface of the wafer.