发明名称 PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE MATERIAL, PRODUCTION OF RELIEF PATTERN AND PRODUCTION OF POLYIMIDE PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive composition and a photosensitive material which exhibit excellent photosensitive characteristics and shelf stability and have high resolution and good process stability, and to produce a relief pattern and a polyimide pattern. SOLUTION: The photosensitive composition contains an α-(alkylthio) acrylonitrile of formula I, a titanocene compound of formula II and an addition polymerizable compound. The photosensitive material contains an α-(alkylthio) acrylonitrile of formula I, a titanocene compound of formula II and a polyimide precursor having a carbon-carbon double bond capable of dimerization or polymerization under actinic rays. A coating of the photosensitive composition or the photosensitive material is patternwise irradiated with active rays and the unirradiated part is removed by development.
申请公布号 JP2001092133(A) 申请公布日期 2001.04.06
申请号 JP19990269673 申请日期 1999.09.24
申请人 HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD 发明人 SASAKI HAN
分类号 G03F7/029;C08F28/02;G03F7/004;G03F7/027 主分类号 G03F7/029
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