发明名称 |
PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE MATERIAL, PRODUCTION OF RELIEF PATTERN AND PRODUCTION OF POLYIMIDE PATTERN |
摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive composition and a photosensitive material which exhibit excellent photosensitive characteristics and shelf stability and have high resolution and good process stability, and to produce a relief pattern and a polyimide pattern. SOLUTION: The photosensitive composition contains an α-(alkylthio) acrylonitrile of formula I, a titanocene compound of formula II and an addition polymerizable compound. The photosensitive material contains an α-(alkylthio) acrylonitrile of formula I, a titanocene compound of formula II and a polyimide precursor having a carbon-carbon double bond capable of dimerization or polymerization under actinic rays. A coating of the photosensitive composition or the photosensitive material is patternwise irradiated with active rays and the unirradiated part is removed by development. |
申请公布号 |
JP2001092133(A) |
申请公布日期 |
2001.04.06 |
申请号 |
JP19990269673 |
申请日期 |
1999.09.24 |
申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD |
发明人 |
SASAKI HAN |
分类号 |
G03F7/029;C08F28/02;G03F7/004;G03F7/027 |
主分类号 |
G03F7/029 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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